Eda pad package library updating/application method and system, medium and terminal

ABSTRACT

An EDA pad package library updating/application method and system, a medium, and a terminal. The method includes: extracting a graphic data of a pad and setting information of a component based on the pad from an EDA wiring data; querying and downloading a graphic model of the component according to attribute information of the component; forming a simulated package pad by simulating and assembling the graphical model of the component and the graphical data of the pad according to setting information of the component based on the pad; storing the simulated package pad in a model database, updating an existed EDA pad package library by associating the simulated package pad to a predetermined keyword/words in the model database. A package pad created by others can be quickly obtained without a package pad library. The best pads that have been verified can be updated continuously and quickly.

BACKGROUND Field of Disclosure

The present disclosure belongs to the technical field of pad packaging,and relates to an updating/application method and system, in particularto an Electronic Design Automation (EDA) pad package libraryupdating/application method and system, a medium and a terminal.

Description of Related Arts

Pad package library is the most important library involved in EDA wiringdesign. In the initial stage of design, EDA designers basically draw thepads according to the recommended pads in the component dataspecification datasheet PDF document. There are two current pad drawingmethods, one is to draw through the functional module that comes withthe EDA wiring software, and the other is to use a third-party paddrawing tool, such as “LP Wizard”.

It is troublesome to draw pads using EDA software's own module, whichmainly depends on the engineer's experience. The engineers are requiredto have a very proficient level and draw the package pads while lookingat the datasheet. Obviously, this method is inefficient.

Although the third-party pad drawing tool “LP Wizard” is convenient todraw, which can improve the drawing speed by using the IPC-7351standard, it is still not possible to achieve rapid and batch drawingpad packaging and optimization and refinement of pad packaging.

Therefore, how to provide an EDA pad package libraryupdating/application method and system, a medium, and a terminal tosolve the defects of the existing technology, such as to achieve therapid and batch drawing pad packaging and the optimization andextraction of pad packaging, has become a technical problem to be solvedby those skilled in the art.

SUMMARY

The present disclosure provides an EDA pad package libraryupdating/application method and system, a medium, and a terminal tosolve the problem that the rapid and batch drawing pad packaging and theoptimization and extraction of pad packaging cannot be achieved.

The present disclosure provides an EDA pad package library updatingmethod. The method includes: extracting a graphic data of a pad andsetting information of a component based on the pad from an EDA wiringdata; querying and downloading a graphic model of the componentaccording to attribute information of the component; forming a simulatedpackage pad by simulating and assembling the graphical model of thecomponent and the graphical data of the pad according to the settinginformation of the component based on the pad; and storing the simulatedpackage pad in a model database, and updating an existed EDA pad packagelibrary by associating the simulated package pad to a predeterminedkeyword/words in the model database.

In an embodiment of the present disclosure, the EDA pad package libraryupdating method further includes: uploading the updated EDA pad packagelibrary to a server.

In an embodiment of the present disclosure, the attribute information ofthe component includes a manufacturer name and a manufacturer code ofthe component, or a bill of material; and the setting information of thecomponent based on the pad includes coordinate information of thecomponent on the pad and a placement angle of the component in the pad.

In an embodiment of the present disclosure, the querying and downloadingof the graphic model of the component according to the attributeinformation of the component includes: querying and downloading thegraphic model of the component from the model database according to themanufacturer name and the manufacturer code of the component, oraccording to the bill of material.

In an embodiment of the present disclosure, the forming of the simulatedpackage pad by simulating and assembling the graphical model of thecomponent and the graphical data of the pad according to the settinginformation of the component based on the pad includes: drawing thegraphic model of the component on the pad according to the coordinateinformation of the component on the pad and the placement angle of thecomponent in the pad until all pins of the component collide with thepad.

In an embodiment of the present disclosure, the updating of the existedEDA pad package library includes: creating the package pad stored in themodel database or updating the package pad stored in the model databaseto the EDA pad package library by using an API interface of the EDA.

The present disclosure further provides an application method based onthe EDA pad package library updating method. The application methodincludes: sending a connection request from a client terminal to aserver to be uploaded, wherein the EDA pad packaging library is storedon the server; and querying a corresponding EDA pad package libraryaccording to attribute information of the pad or a keyword/words of thepad.

The present disclosure further provides an EDA pad package libraryupdating system. The updating system includes: an extraction module forextracting a graphic data of a pad and setting information of acomponent based on the pad from an EDA wiring data; a query downloadmodule for querying and downloading a graphic model of the componentaccording to attribute information of the component; a simulation modulefor forming a simulated package pad by simulating and assembling thegraphical model of the component and the graphical data of the padaccording to the setting information of the component based on the pad;a storage module for storing the simulated package pad in a modeldatabase; and an association module for updating an existed EDA padpackage library by associating the simulated package pad to apredetermined keyword/words in the model database.

The present disclosure further provides an application system based onthe EDA pad package library updating system. The application systemincludes: a communication module for sending a connection request from aclient terminal to a server to be uploaded, wherein the EDA padpackaging library is stored on the server; and a query module forquerying a corresponding EDA pad package library according to attributeinformation of the pad or a keyword/word of the pad.

The present disclosure further provides a storage medium storing acomputer program, when executed by a processor, the computer programcauses the processor to implement the EDA pad package library updatingmethod or the application method based on the EDA pad package libraryupdating method.

The present disclosure further provides a terminal. The terminalincludes a processor and a memory; the memory stores a computer program,and the processor executes the computer program stored in the memory,such that the terminal implements the EDA pad package library updatingmethod or the application method based on the EDA pad package libraryupdating method.

As described above, the EDA pad package library updating/applicationmethod and system, the medium, and the terminal of the presentdisclosure have the following beneficial effects:

First, a package pad created by others can be quickly obtained without apackage pad library.

Second, the best pads that have been verified can be updatedcontinuously and quickly.

Third, data is stored for big data analysis of a physical componentcorresponding to the package pad.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a schematic view of a scenario where the EDA pad packagelibrary updating method of the present disclosure is applied.

FIG. 2 shows a schematic flow chart of the EDA pad package libraryupdating method according to an embodiment of the present disclosure.

FIG. 3 shows a schematic view of an EDA pad package library updatingsystem according to an embodiment of the present disclosure.

FIG. 4 shows a schematic view of a terminal according to an embodimentof the present disclosure.

DESCRIPTION OF REFERENCE NUMERALS

-   -   11 Terminal    -   12 Server    -   3 EDA pad package library updating system    -   31 Extraction module    -   32 Query download module    -   33 Simulation module    -   34 Storage module    -   35 Association module    -   36 Update module    -   37 Communication module    -   4 Terminal    -   41 Processor    -   42 Memory    -   43 Transceiver    -   44 Communication interface    -   45 System bus    -   S21-S25 Operations

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The embodiments of the present disclosure will be described belowthrough exemplary embodiments. Those skilled in the art can easilyunderstand other advantages and effects of the present disclosureaccording to contents disclosed by the specification. The presentdisclosure can also be implemented or applied through other differentexemplary embodiments. Various modifications or changes can also be madeto all details in the specification based on different points of viewand applications without departing from the spirit of the presentdisclosure. It needs to be stated that the following embodiments and thefeatures in the embodiments can be combined with one another under thesituation of no conflict.

It needs to be stated that the drawings provided in the followingembodiments are just used for schematically describing the basic conceptof the present disclosure, thus only illustrating components onlyrelated to the present disclosure and are not drawn according to thenumbers, shapes and sizes of components during actual implementation,the configuration, number and scale of each component during actualimplementation thereof may be freely changed, and the component layoutconfiguration thereof may be more complicated.

At present, the establishment of the package pad library for designingEDA in the industry is drawn by the EDA designer according to therecommended pad in the datasheet provided by the component manufacturer.However, the recommended pad has not been fully verified by actualassembly, nor has it been improved and verified based on actual productrequirements. The EDA pad package library updating method and the EDApad package library application method of the present disclosure canextract the pad package of the wiring PCB board designed by other EDAdesigners that has been manufactured and return the pad package to theEDA library, to realize the sharing of post-packaged pad library withoutbeing restricted by design software. That is, as long as the usedcomponent is unchanged, the package pad library can be shared, and ithas been verified through actual production.

Embodiment 1

This embodiment provides an EDA pad package library updating method. Theupdating method includes: extracting a graphic data of a pad and settinginformation of a component based on the pad from an EDA wiring data;querying and downloading a graphic model of the component according toattribute information of the component; forming a simulated package padby simulating and assembling the graphical model of the component andthe graphical data of the pad according to the setting information ofthe component based on the pad; and storing the simulated package pad ina model database, and updating an existed EDA pad package library byassociating the simulated package pad to a predetermined keyword/word inthe model database.

The EDA pad package library updating method provided in this embodimentwill be described in detail below with reference to the drawings. TheEDA pad package library updating method in this embodiment is applied tothe scenario shown in FIG. 1. The scenario includes a terminal 11 and aserver 12 communicating with the terminal 11, and the server 12 includesa cloud terminal or a local area network server.

Referring to FIG. 2, which shows a schematic flowchart of an EDA padpackage library updating method in an embodiment. As shown in FIG. 2,the EDA pad package library updating method specifically includes thefollowing operations:

S21: extracting a graphic data of a pad and setting information of acomponent based on the pad from an EDA wiring data. In this embodiment,the setting information of the component based on the pad includescoordinate information of the component on the pad and a placement angleof the component in the pad.

S22: querying and downloading a graphic model of the component accordingto attribute information of the component. In this embodiment, theattribute information of the component includes a manufacturer name anda manufacturer code of the component, or a bill of material.

For example, the manufacturer name of the component A1 is A2 and themanufacturer code of the component A1 is A3, the graphic model of thecomponent corresponding to the manufacturer name A2 and the manufacturercode A3 is queried and downloaded from the preset model database (or thepreset 2D or 3D model database).

S23: forming a simulated package pad by simulating and assembling thegraphical model of the component and the graphical data of the padthrough the setting information of the component based on the pad.

In this operation, first find the corresponding position on thegraphical data of the pad according to the coordinate information of thecomponent on the pad, and then draw the graphical model of the componenton the pad according to the placement angle of the component in the paduntil all the pins of the component hit the pad.

For example, if the placement angle cannot make all the pins hit thepad, add 90 degrees to the placement angle. If it is still not possibleto make all the pins hit the pad, the physical component is placed byadding the placement angle for 1 degree each time until all the pins hitthe pad.

S24: after all the components are assembled on the graphical data of thepad, extracting the graphics such as the pad and the silk screen touchedby the pins into the memory, and storing the extracted simulated packagepad in a model database. In this embodiment, the simulated package padincludes a pad layer, a silk screen layer, a solder resist layer, akeepout layer, and the like. In this embodiment, while the extractedgraphic is saved in the model database, in the model database, anexisted EDA pad package library is updated by associating the simulatedpackage pad to a predetermined keyword/words or by adding keywords inthe related fields of EDA wiring for the simulated package pad, such aspower board, RF board, base station board, mobile phone board, etc. Inthis embodiment, the predetermined keyword/words include themanufacturer name and the manufacturer code.

In this embodiment, the package pad stored in the model database iscreated or updated to the EDA pad package library by using an APIinterface of the EDA.

Specifically, EDA's API interface is used. For example, CADENCEAllegro's script or skill is used to update the pad layer and silkscreen and other layers in the *.dra file, or the script or skilllanguage is run to create a new package for designing wiring.

For example, the EDA pad package library design software requests togenerate its script and generate a new dra file. Different EDA softwaresuse the corresponding API interfaces to generate the EDA pad packagelibrary files.

In this embodiment, other EDA design softwares such as Altium Designer,PADS, etc. are also used to implement the above-mentioned EDA padpackage library updating method.

S25: uploading the formed EDA pad package library to a server.

This embodiment further provides an application method based on theabove EDA pad package library updating method. The application methodincludes: sending a connection request from a client terminal to aserver to be uploaded, the EDA pad packaging library is stored on theserver; and querying a corresponding EDA pad package library accordingto attribute information of the pad or a keyword/words of the pad.

This embodiment further provides a storage medium (also referred tocomputer readable storage medium), which stores a computer program, whenexecuted by a processor, the computer program causes the processor toimplement the EDA pad package library updating method or the applicationmethod based on the EDA pad package library updating method.

Those of ordinary skill will understand that all or part of theoperations to implement the various method embodiments described abovemay be accomplished by hardware associated with a computer program. Thecomputer program may be stored in a computer readable storage medium.The program, when executed, performs the operations including the abovemethod embodiments. The foregoing storage medium includes various mediumthat may store program codes, such as a ROM, a RAM, a magnetic disk, oran optical disk.

The EDA pad package library updating method and the EDA pad packagelibrary application method described in this embodiment have thefollowing beneficial effects:

First, a package pad created by others can be quickly obtained without apackage pad library.

Second, the best pads that have been verified can be updatedcontinuously and quickly.

Third, data is stored for big data analysis of a physical componentcorresponding to the package pad.

Embodiment 2

This embodiment provides an EDA pad package library updating system. Theupdating system includes: an extraction module for extracting a graphicdata of a pad and setting information of a component based on the padfrom an EDA wiring data; a query download module for querying anddownloading a graphic model of the component according to attributeinformation of the component; a simulation module for forming asimulated package pad by simulating and assembling the graphical modelof the component and the graphical data of the pad according to thesetting information of the component based on the pad; a storage modulefor storing the simulated package pad in a model database; and anassociation module for updating an existed EDA pad package library byassociating the simulated package pad to a predetermined keyword/wordsin the model database.

The EDA pad package library updating system provided in this embodimentwill be described in detail below with reference to the drawings. Itshould be noted that the division of each module of the above system isonly a division of logical functions. In actual implementation, themodules may be integrated into one physical entity in whole or in part,or may be physically separated. And these modules may all be implementedin the form of processing component calling by software, or they may allbe implemented in the form of hardware. It is also possible that somemodules are implemented in the form of processing component calling bysoftware, and some modules are implemented in the form of hardware. Forexample, an x module may be a separate processing component, or may beintegrated in a chip of the above-mentioned system. In addition, the xmodule may also be stored in the memory of the above system in the formof program code. The function of the above x module is called andexecuted by a processing component of the above system. Theimplementation of other modules is similar. All or part of these modulesmay be integrated or implemented independently. The processing elementsdescribed herein may be an integrated circuit with signal processingcapabilities. In the implementation process, each operation of the abovemethod or each of the above modules may be completed by an integratedlogic circuit of hardware in the processor element or an instruction ina form of software. The above modules may be one or more integratedcircuits configured to implement the above method, such as one or moreApplication Specific Integrated Circuits (ASICs), one or more DigitalSignal Processors (DSPs), or one or more Field Programmable Gate Arrays(FPGAs). When one of the following modules is implemented in the form ofcalling program codes by a processing component, the processingcomponent may be a general processor, such as a Central Processing Unit(CPU) or other processors that may call program codes. These modules maybe integrated and implemented in the form of a system-on-a-chip (SOC).

Referring to FIG. 3, the updating system 3 of the EDA pad packagelibrary includes: an extraction module 31, a query download module 32, asimulation module 33, a storage module 34, an association module 35, anupdate module 36, and a communication module 37.

The extraction module 31 extracts a graphic data of a pad and settinginformation of a component based on the pad from an EDA wiring data. Inthis embodiment, the setting information of the component based on thepad includes coordinate information of the component on the pad and aplacement angle of the component in the pad.

The query download module 32 coupled with the extraction module 31queries and downloads a graphic model of the component according toattribute information of the component. In this embodiment, theattribute information of the component includes a manufacturer name anda manufacturer code of the component, or a bill of material.

The simulation module 33 coupled with the extraction module 31 and thequery download module 32 forms a simulated package pad by simulating andassembling the graphical model of the component and the graphical dataof the pad through the setting information of the component based on thepad.

First, the simulation module 33 finds the corresponding position on thegraphical data of the pad according to the coordinate information of thecomponent on the pad, and then draws the graphical model of thecomponent on the pad according to the placement angle of the componentin the pad until all the pins of the component hit the pad.

After all the components are assembled on the graphical data of the pad,the extraction module 31 extracts the graphics such as the pad and thesilk screen touched by the pins into the memory, and the storage module34 stores the extracted simulated package pad in a model database. Inthis embodiment, the simulated package pad includes a pad layer, a silkscreen layer, a solder resist layer, a keepout layer, and the like. Inthis embodiment, while the extracted graphic is saved in the modeldatabase, in the model database, the association module 35 coupled withthe simulation module 33 and the storage module 34 associates thesimulated package pad to a predetermined keyword/words, or keywords inthe related fields of EDA wiring are added for the simulated packagepad, such as power board, RF board, base station board, mobile phoneboard, etc., to update the existed EDA pad package library. In thisembodiment, the predetermined keyword/words include the manufacturername and the manufacturer code.

In this embodiment, the update module 36 coupled with the associationmodule 35 creates or updates the package pad stored in the modeldatabase to the EDA pad package library by using an API interface of theEDA.

Specifically, EDA's API interface is used. For example, CADENCEAllegro's script or skill is used to update the pad layer and silkscreen and other layers in the *.dra file, or the script or skilllanguage is run to create a new package for designing wiring.

For example, the EDA pad package library design software requests togenerate its script and generate a new dra file. Different EDA softwaresuse the corresponding API interfaces to generate the EDA pad packagelibrary files.

In this embodiment, other EDA design softwares such as Altium Designer,PADS, etc. are also used to implement the above-mentioned EDA padpackage library updating system.

The communication module 37 coupled with the update module 36 uploadsthe formed EDA pad package library to a server.

This embodiment further provides an application system based on theabove EDA pad package library updating system. The application systemincludes:

a communication module for sending a connection request from a clientterminal to a server to be uploaded, the EDA pad packaging library isstored on the server; and

a query module for querying a corresponding EDA pad package libraryaccording to attribute information of the pad or a keyword/words of thepad.

Embodiment 3

This embodiment provides a terminal 4, and the terminal 4 includes: aprocessor 41, a memory 42, a transceiver 43, a communication interface44, or/and a system bus 45. The memory 42 and communication interface 44are coupled with the processor 41 and the transceiver 43 through thesystem bus 45 to implement mutual communication. The memory 42 storescomputer programs, the communication interface 44 communicates withother devices, and the processor 41 and transceiver 43 run computerprograms to cause the terminal 4 to perform the operations of the EDApad package library updating method or the operations of the applicationmethod based on the EDA pad package library updating method.

The system bus mentioned above may be a Peripheral ComponentInterconnect (PCI) bus or an Extended Industry Standard Architecture(EISA) bus, etc. The system bus may be divided into address bus, databus, control bus and so on. For convenience of representation, only athick line is used in the figure, but it does not mean that there isonly one bus or one type of bus. The communication interface is used toimplement communication between the database access device and otherdevices (such as a client, a read-write library, and a read-onlylibrary). The memory may include Random Access Memory (RAM), or may alsoinclude non-volatile memory, such as at least one disk memory.

The above processor may be a general processor, including a CentralProcessing Unit (CPU), a Network Processor (NP), and the like. It mayalso be a Digital Signal Processor (DSP), an Application SpecificIntegrated Circuit (ASIC), a Field-Programmable Gate Array (FPGA), orother programmable logic devices, discrete gate or transistor logicdevices, or discrete hardware components.

As described above, the EDA pad package library updating/applicationmethod and system, the medium, and the terminal of the presentdisclosure have the following beneficial effects:

First, a package pad created by others can be quickly obtained without apackage pad library.

Second, the best pads that have been verified can be updatedcontinuously and quickly.

Third, data is stored for big data analysis of a physical componentcorresponding to the package pad.

The present disclosure effectively overcomes various shortcomings andhas high industrial utilization value.

The above-mentioned embodiments are just used for exemplarily describingthe principle and effects of the present disclosure instead of limitingthe present disclosure. Those skilled in the art can make modificationsor changes to the above-mentioned embodiments without going against thespirit and the range of the present disclosure. Therefore, allequivalent modifications or changes made by those who have commonknowledge in the art without departing from the spirit and technicalconcept disclosed by the present disclosure shall be still covered bythe claims of the present disclosure.

1. An EDA pad package library updating method, comprising: extracting agraphic data of a pad and setting information of a component based onthe pad from an EDA wiring data; querying and downloading a graphicmodel of the component according to attribute information of thecomponent; forming a simulated package pad by simulating and assemblingthe graphical model of the component and the graphical data of the padaccording to the setting information of the component based on the pad;and storing the simulated package pad in a model database, and updatingan existed EDA pad package library by associating the simulated packagepad to a predetermined keyword/words in the model database.
 2. The EDApad package library updating method according to claim 1, furthercomprising: uploading the updated EDA pad package library to a server.3. The EDA pad package library updating method according to claim 1,wherein the attribute information of the component includes amanufacturer name and a manufacturer code of the component, or a bill ofmaterial; and the setting information of the component based on the padincludes coordinate information of the component on the pad and aplacement angle of the component in the pad.
 4. The EDA pad packagelibrary updating method according to claim 3, wherein said querying anddownloading of the graphic model of the component according to theattribute information of the component comprises: querying anddownloading the graphic model of the component from the model databaseaccording to the manufacturer name and the manufacturer code of thecomponent, or according to the bill of material.
 5. The EDA pad packagelibrary updating method according to claim 3, wherein said forming ofthe simulated package pad by simulating and assembling the graphicalmodel of the component and the graphical data of the pad according tothe setting information of the component based on the pad comprises:drawing the graphic model of the component on the pad according to thecoordinate information of the component on the pad and the placementangle of the component in the pad until all pins of the componentcollide with the pad.
 6. The EDA pad package library updating methodaccording to claim 3, wherein said updating of the existed EDA padpackage library comprises: creating the package pad stored in the modeldatabase or updating the package pad stored in the model database to theEDA pad package library by using an API interface of the EDA.
 7. Anapplication method based on the EDA pad package library updating methodaccording to claim 1, comprising: sending a connection request from aclient terminal to a server to be uploaded, wherein the EDA padpackaging library is stored on the server; and querying a correspondingEDA pad package library according to attribute information of the pad ora keyword/words of the pad.
 8. An EDA pad package library updatingsystem, comprising: an extraction module for extracting a graphic dataof a pad and setting information of a component based on the pad from anEDA wiring data; a query download module for querying and downloading agraphic model of the component according to attribute information of thecomponent; a simulation module for forming a simulated package pad bysimulating and assembling the graphical model of the component and thegraphical data of the pad according to the setting information of thecomponent based on the pad; a storage module for storing the simulatedpackage pad in a model database; and an association module for updatingan existed EDA pad package library by associating the simulated packagepad to a predetermined keyword/words in the model database.
 9. Anapplication system based on the EDA pad package library updating systemaccording to claim 8, comprising: a communication module for sending aconnection request from a client terminal to a server to be uploaded,wherein the EDA pad packaging library is stored on the server; and aquery module for querying a corresponding EDA pad package libraryaccording to attribute information of the pad or a keyword/words of thepad.
 10. A storage medium storing a computer program, when executed by aprocessor, the computer program causes the processor to implement an EDApad package library updating method or the application method based onthe EDA pad package library updating method according to claim 7,wherein the EDA pad package library updating method comprises:extracting a graphic data of a pad and setting information of acomponent based on the pad from an EDA wiring data; querying anddownloading a graphic model of the component according to attributeinformation of the component; forming a simulated package pad bysimulating and assembling the graphical model of the component and thegraphical data of the pad through the setting information of thecomponent based on the pad; and storing the simulated package pad in amodel database, and updating an existed EDA pad package library byassociating according to a predetermined keyword/word in the modeldatabase.
 11. A terminal, comprising a processor and a memory; whereinthe memory is configured to store a computer program, and the processoris configured to execute the computer program stored in the memory, suchthat the terminal implements an EDA pad package library updating methodor the application method based on the EDA pad package library updatingmethod according to claim 7, wherein the EDA pad package libraryupdating method comprises: extracting a graphic data of a pad andsetting information of a component based on the pad from an EDA wiringdata; querying and downloading a graphic model of the componentaccording to attribute information of the component; forming a simulatedpackage pad by simulating and assembling the graphical model of thecomponent and the graphical data of the pad through the settinginformation of the component based on the pad; and storing the simulatedpackage pad in a model database, and updating an existed EDA pad packagelibrary by associating according to a predetermined keyword/word in themodel database.